Estimated delivery dates: Jan 23, 2026 - Jan 25, 2026
● Aluminum Alloy Heat Sink for Superior Heat Dissipation
● Enhanced Stability and Efficiency with PMIC
● On-Die ECC for Improved Stability
● Intel® XMP 3.0 Support
● Meticulously Screened DRAM ICs
● Low Power Consumption, High Performance
● QVL Compatibility Certification